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Adapter, Breakout Boards

DC0402S-10X
Chip Quik Inc.

DC0402S-10X

Dele Stock.: 14949

Proto Board Type: SMD to DIP, Pakke accepteret: 0402, Antal positioner: 2, Board tykkelse: 0.031" (0.79mm) 1/32", Materiale: FR4 Epoxy Glass,

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PA0071
Chip Quik Inc.

PA0071

Dele Stock.: 7042

Proto Board Type: SMD to DIP, Pakke accepteret: QFN, Antal positioner: 40, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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IPC0103
Chip Quik Inc.

IPC0103

Dele Stock.: 12710

Proto Board Type: SMD to DIP, Pakke accepteret: LGA, Antal positioner: 10, Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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F200T254P08
Chip Quik Inc.

F200T254P08

Dele Stock.: 43355

Proto Board Type: Plated Through Hole to Plated Through Hole, Antal positioner: 8, Tonehøjde: 0.079" (2.00mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,

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PA0016
Chip Quik Inc.

PA0016

Dele Stock.: 17943

Proto Board Type: SMD to DIP, Pakke accepteret: SSOP, Antal positioner: 14, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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PA0092
Chip Quik Inc.

PA0092

Dele Stock.: 8781

Proto Board Type: SMD to DIP, Pakke accepteret: TQFP, Antal positioner: 32, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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DC0805J-10X
Chip Quik Inc.

DC0805J-10X

Dele Stock.: 337

Proto Board Type: SMD to Plated Through Hole, Pakke accepteret: 0805, Antal positioner: 2, Tonehøjde: 0.078" (1.98mm), Materiale: FR4 Epoxy Glass,

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CN0035
Chip Quik Inc.

CN0035

Dele Stock.: 13917

Proto Board Type: Connector to SIP, Pakke accepteret: RJ45, Ethernet Plug, Antal positioner: 8, Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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PA0062
Chip Quik Inc.

PA0062

Dele Stock.: 15369

Proto Board Type: SMD to DIP, Pakke accepteret: QFN, Antal positioner: 16, Tonehøjde: 0.031" (0.80mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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DC0402J-10X
Chip Quik Inc.

DC0402J-10X

Dele Stock.: 308

Proto Board Type: SMD to Plated Through Hole, Pakke accepteret: 0402, Antal positioner: 2, Tonehøjde: 0.036" (0.91mm), Materiale: FR4 Epoxy Glass,

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CN0007
Chip Quik Inc.

CN0007

Dele Stock.: 13878

Proto Board Type: Connector to SIP, Pakke accepteret: USB - B, Antal positioner: 4, Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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PA0094
Chip Quik Inc.

PA0094

Dele Stock.: 5390

Proto Board Type: SMD to DIP, Pakke accepteret: LQFP, TQFP, Antal positioner: 48, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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PA0107SOCKET
Chip Quik Inc.

PA0107SOCKET

Dele Stock.: 3715

Proto Board Type: SMD to DIP, Pakke accepteret: LCC, JLCC, PLCC, Antal positioner: 44, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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PA0188
Chip Quik Inc.

PA0188

Dele Stock.: 4838

Proto Board Type: SMD to PGA, Pakke accepteret: LQFP, Antal positioner: 144, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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PA0049
Chip Quik Inc.

PA0049

Dele Stock.: 23000

Proto Board Type: SMD to DIP, Pakke accepteret: DFN, MLP, Antal positioner: 6, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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CN0030
Chip Quik Inc.

CN0030

Dele Stock.: 13871

Proto Board Type: Connector to SIP, Pakke accepteret: DB9, Antal positioner: 9, Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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PA0194
Chip Quik Inc.

PA0194

Dele Stock.: 12726

Proto Board Type: SMD to DIP, Pakke accepteret: TSSOP, Antal positioner: 20, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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DC0603J-10X
Chip Quik Inc.

DC0603J-10X

Dele Stock.: 418

Proto Board Type: SMD to Plated Through Hole, Pakke accepteret: 0603, Antal positioner: 2, Tonehøjde: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,

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FPC100P030
Chip Quik Inc.

FPC100P030

Dele Stock.: 12716

Proto Board Type: SMD to DIP, Pakke accepteret: FPC Connector, Antal positioner: 30, Tonehøjde: 0.039" (1.00mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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DR127D254P10M
Chip Quik Inc.

DR127D254P10M

Dele Stock.: 9927

Proto Board Type: Connector to DIP, Pakke accepteret: 1.27mm Header, Antal positioner: 10, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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F200T254P20
Chip Quik Inc.

F200T254P20

Dele Stock.: 21636

Proto Board Type: Plated Through Hole to Plated Through Hole, Antal positioner: 20, Tonehøjde: 0.079" (2.00mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,

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PA0018
Chip Quik Inc.

PA0018

Dele Stock.: 15342

Proto Board Type: SMD to DIP, Pakke accepteret: SSOP, Antal positioner: 20, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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CN0009
Chip Quik Inc.

CN0009

Dele Stock.: 13896

Proto Board Type: Connector to SIP, Pakke accepteret: USB - micro B, Antal positioner: 5, Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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US-2010
Capital Advanced Technologies

US-2010

Dele Stock.: 48586

Proto Board Type: Through Hole to SIP, Pakke accepteret: Non Specific, Antal positioner: 10, Board tykkelse: 0.031" (0.79mm) 1/32", Materiale: FR4 Epoxy Glass,

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US-5020
Capital Advanced Technologies

US-5020

Dele Stock.: 18227

Proto Board Type: Through Hole to SIP, Pakke accepteret: Non Specific, Antal positioner: 20, Board tykkelse: 0.031" (0.79mm) 1/32", Materiale: FR4 Epoxy Glass,

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US-2006
Capital Advanced Technologies

US-2006

Dele Stock.: 76377

Proto Board Type: Through Hole to SIP, Pakke accepteret: Non Specific, Antal positioner: 6, Board tykkelse: 0.031" (0.79mm) 1/32", Materiale: FR4 Epoxy Glass,

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US-4010
Capital Advanced Technologies

US-4010

Dele Stock.: 37813

Proto Board Type: Through Hole to SIP, Pakke accepteret: Non Specific, Antal positioner: 10, Board tykkelse: 0.031" (0.79mm) 1/32", Materiale: FR4 Epoxy Glass,

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US-3010
Capital Advanced Technologies

US-3010

Dele Stock.: 37807

Proto Board Type: Through Hole to SIP, Pakke accepteret: Non Specific, Antal positioner: 10, Board tykkelse: 0.031" (0.79mm) 1/32", Materiale: FR4 Epoxy Glass,

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US-4012
Capital Advanced Technologies

US-4012

Dele Stock.: 32326

Proto Board Type: Through Hole to SIP, Pakke accepteret: Non Specific, Antal positioner: 12, Board tykkelse: 0.031" (0.79mm) 1/32", Materiale: FR4 Epoxy Glass,

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US-3014
Capital Advanced Technologies

US-3014

Dele Stock.: 28206

Proto Board Type: Through Hole to SIP, Pakke accepteret: Non Specific, Antal positioner: 14, Board tykkelse: 0.031" (0.79mm) 1/32", Materiale: FR4 Epoxy Glass,

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US-2012
Capital Advanced Technologies

US-2012

Dele Stock.: 42410

Proto Board Type: Through Hole to SIP, Pakke accepteret: Non Specific, Antal positioner: 12, Board tykkelse: 0.031" (0.79mm) 1/32", Materiale: FR4 Epoxy Glass,

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PA-SSD3SM18-28
Logical Systems Inc.

PA-SSD3SM18-28

Dele Stock.: 5244

Proto Board Type: SMD to DIP, Pakke accepteret: SSOP, TSSOP, Antal positioner: 28, Tonehøjde: 0.026" (0.65mm),

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PA-SSD3SM18-08
Logical Systems Inc.

PA-SSD3SM18-08

Dele Stock.: 14682

Proto Board Type: SMD to DIP, Pakke accepteret: SSOP, TSSOP, Antal positioner: 8, Tonehøjde: 0.026" (0.65mm),

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LCQT-TSOP32-1
Aries Electronics

LCQT-TSOP32-1

Dele Stock.: 10145

Proto Board Type: SMD to DIP, Pakke accepteret: TSOP, Antal positioner: 32, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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LCQT-QFP0.5-64
Aries Electronics

LCQT-QFP0.5-64

Dele Stock.: 8189

Proto Board Type: SMD to DIP, Pakke accepteret: QFP, Antal positioner: 64, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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LCQT-SOIC14W
Aries Electronics

LCQT-SOIC14W

Dele Stock.: 17982

Proto Board Type: SMD to DIP, Pakke accepteret: SOIC, Antal positioner: 14, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,

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