Proto Board Type: SMD to PGA, Pakke accepteret: TQFP, Antal positioner: 144, Tonehøjde: 0.016" (0.40mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: QFN, Antal positioner: 36, Tonehøjde: 0.035" (0.90mm),
Proto Board Type: SMD to DIP, Pakke accepteret: LGA, Antal positioner: 10, Tonehøjde: 0.016" (0.40mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: TSSOP, Antal positioner: 64, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SOP, Antal positioner: 36, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: TSSOP, Antal positioner: 44, Tonehøjde: 0.025" (0.64mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: DFN, Antal positioner: 10, Tonehøjde: 0.016" (0.40mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: QFN, Antal positioner: 14, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: PowerSOIC, Antal positioner: 28, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SSOP, Antal positioner: 24, Tonehøjde: 0.039" (1.00mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: PowerSOIC, Antal positioner: 24, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Pakke accepteret: RQFP, QFP, Antal positioner: 240, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: QFN, Antal positioner: 24, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: BGA, Antal positioner: 24, Tonehøjde: 0.039" (1.00mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Tonehøjde: 0.047" (1.20mm),
Proto Board Type: SMD to DIP, Pakke accepteret: QFN, Antal positioner: 28, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Pakke accepteret: PQFP, Antal positioner: 100, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: PowerSOIC, Antal positioner: 16, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: QFN, Antal positioner: 2, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: BGA, Antal positioner: 25, Tonehøjde: 0.039" (1.00mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Pakke accepteret: LCC, JLCC, PLCC, Antal positioner: 84, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: TQFP, Antal positioner: 80, Tonehøjde: 0.031" (0.80mm),
Proto Board Type: SMD to PGA, Pakke accepteret: LQFP, PQFP, Antal positioner: 128, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: MSOP, Antal positioner: 12, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: DFN, MLP, Antal positioner: 8, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: QFN, Antal positioner: 28, Tonehøjde: 0.026" (0.65mm),
Proto Board Type: SMD to DIP, Pakke accepteret: DFN, Antal positioner: 8, Tonehøjde: 0.038" (0.97mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: TSSOP, Antal positioner: 56, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: DFN, Antal positioner: 12, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: TSSOP, Antal positioner: 48, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SOIC, Antal positioner: 32, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: DFN, Antal positioner: 8, Tonehøjde: 0.018" (0.45mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Pakke accepteret: LQFP, Antal positioner: 128, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SOP, Antal positioner: 8,
Proto Board Type: SMD to DIP, Pakke accepteret: SSOP, TSSOP, Antal positioner: 28, Tonehøjde: 0.026" (0.65mm),
