Proto Board Type: SMD to DIP, Pakke accepteret: SOIC, Antal positioner: 8, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SOIC, Antal positioner: 14, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SOIC, Antal positioner: 16, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Antal positioner: 10, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SOIC, Antal positioner: 18, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Antal positioner: 12, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SSOP, Antal positioner: 14, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SSOP, Antal positioner: 16, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to SMD, Pakke accepteret: SOIC, Antal positioner: 16, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SSOP, Antal positioner: 14, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to DIP, Pakke accepteret: SSOP, Antal positioner: 16, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SOT, Antal positioner: 6, Tonehøjde: 0.037" (0.95mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SOIC, Antal positioner: 8, Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SSOP, Antal positioner: 20, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to DIP, Pakke accepteret: SOIC, Antal positioner: 28, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: Connector to DIP, Pakke accepteret: CR1220, Antal positioner: 4, Tonehøjde: 0.100" (2.54mm),
Proto Board Type: SMD to DIP, Pakke accepteret: QFN, QFP, Antal positioner: 48,
Proto Board Type: Connector to DIP, Pakke accepteret: CR2032, Antal positioner: 4, Tonehøjde: 0.100" (2.54mm), Board tykkelse: 0.060" (1.52mm),
Proto Board Type: SMD to DIP, Pakke accepteret: QFN, QFP, Antal positioner: 32,
Proto Board Type: SMD to Plated Through Hole Board, Pakke accepteret: FPC, Antal positioner: 20,
Proto Board Type: Plated Through Hole to Plated Through Hole, Tonehøjde: 0.197" (5.00mm),
