Proto Board Type: SMD to PGA, Pakke accepteret: PLCC, Antal positioner: 68, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to SIP, Pakke accepteret: SOT-89, Antal positioner: 3, Board tykkelse: 0.031" (0.79mm) 1/32", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to SIP, Pakke accepteret: SOT-23, Antal positioner: 3, Board tykkelse: 0.031" (0.79mm) 1/32", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to SIP, Pakke accepteret: SOIC, Antal positioner: 16, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.031" (0.79mm) 1/32", Materiale: FR4 Epoxy Glass,
Pakke accepteret: SOIC, Antal positioner: 16, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.031" (0.79mm) 1/32", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to Plated Through Hole Board, Pakke accepteret: TSSOP, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to Plated Through Hole Board, Pakke accepteret: TSSOP,
Proto Board Type: SMD to Plated Through Hole Board, Pakke accepteret: SOIC, Board tykkelse: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to DIP, Pakke accepteret: PSOP, SSOP, TSOP, Board tykkelse: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to Plated Through Hole Board, Pakke accepteret: QFP, Board tykkelse: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to Plated Through Hole Board, Pakke accepteret: PLCC, Board tykkelse: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to Plated Through Hole Board, Pakke accepteret: TQFP,
Proto Board Type: SMD to Plated Through Hole Board, Pakke accepteret: SOIC,
Proto Board Type: SMD to Plated Through Hole Board, Pakke accepteret: SOIC, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16",
Proto Board Type: SMD to DIP, Pakke accepteret: SOIC, Antal positioner: 8,
Proto Board Type: SMD to DIP, Pakke accepteret: SSOP, Antal positioner: 16, Tonehøjde: 0.025" (0.64mm),
Proto Board Type: Through Hole to SIP, Pakke accepteret: Rotary Switch, Antal positioner: 11,
Proto Board Type: Through Hole to SIP, Pakke accepteret: Tactile Switch, Antal positioner: 6,
Proto Board Type: SMD to SIP, Pakke accepteret: 1/4" TRS Jack, Antal positioner: 7,
Proto Board Type: SMD to DIP, Pakke accepteret: BGA, Antal positioner: 42, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Pakke accepteret: BGA, Antal positioner: 484, Tonehøjde: 0.039" (1.00mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Pakke accepteret: BGA, Antal positioner: 100, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Pakke accepteret: BGA, Antal positioner: 484, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Pakke accepteret: BGA, Antal positioner: 100, Tonehøjde: 0.031" (0.80mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Pakke accepteret: BGA, Antal positioner: 100, Tonehøjde: 0.039" (1.00mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: BGA, Antal positioner: 54, Tonehøjde: 0.029" (0.75mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: BGA, Antal positioner: 25, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Pakke accepteret: BGA, Antal positioner: 324, Tonehøjde: 0.031" (0.80mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Pakke accepteret: BGA, Antal positioner: 100, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.063" (1.60mm), Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: BGA, Antal positioner: 25, Tonehøjde: 0.016" (0.40mm),
Proto Board Type: SMD to DIP, Pakke accepteret: BGA, Antal positioner: 54, Tonehøjde: 0.047" (1.20mm),
