Type: Powerline Module, Monteringstype: Surface Mount, Pakke / kasse: 50-SSIP Module, Leverandørens enhedspakke: 50-SIP Module,
Type: Digital Micromirror Device (DMD), Monteringstype: Surface Mount, Pakke / kasse: 98-CLCC, Leverandørens enhedspakke: 98-LCCC (20.7x9.1),
Type: Digital Micromirror Device (DMD), Monteringstype: Surface Mount, Pakke / kasse: Module, Leverandørens enhedspakke: 80-LCCC (20.7x9.1),
Type: Digital Micromirror Device (DMD),
Type: Multi-Queue Flow-Control, Monteringstype: Surface Mount, Pakke / kasse: 256-BBGA, Leverandørens enhedspakke: 256-BGA (17x17),
Type: Floating-Point Co-Processor, Monteringstype: Through Hole, Pakke / kasse: 18-DIP (0.300", 7.62mm), Leverandørens enhedspakke: 18-DIP,
Type: Floating-Point Co-Processor, Monteringstype: Through Hole, Pakke / kasse: 8-DIP (0.300", 7.62mm), Leverandørens enhedspakke: 8-DIP,