Proto Board Type: SMD to DIP, Pakke accepteret: FPC Connector, Antal positioner: 70, Tonehøjde: 0.016" (0.40mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: FPC Connector, Antal positioner: 30, Tonehøjde: 0.031" (0.80mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: FPC Connector, Antal positioner: 50, Tonehøjde: 0.016" (0.40mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: HSOP, Antal positioner: 30, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SOIC, Antal positioner: 44, Tonehøjde: 0.031" (0.80mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to PGA, Pakke accepteret: PQFP, QFP, RQFP, Antal positioner: 208, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: QFN, Antal positioner: 32, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: TQFP, Antal positioner: 128, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: TSSOP, Antal positioner: 64, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: TSOP, Antal positioner: 32, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: QFN, Antal positioner: 28, Tonehøjde: 0.018" (0.45mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: DFN, Antal positioner: 5, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: LLP, Antal positioner: 14, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SOT-666, Antal positioner: 6, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: TO-263 (DDPAK/D2PAK), Antal positioner: 9, Tonehøjde: 0.038" (0.97mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: LLP, Antal positioner: 44, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: MiniSOIC EP, Antal positioner: 8, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: LQFP, Antal positioner: 40, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: QFN, Antal positioner: 24, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: PQFP, Antal positioner: 80, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: FPC Connector, Antal positioner: 71, Tonehøjde: 0.012" (0.30mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: DFN, Antal positioner: 4, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SSOP, Antal positioner: 32, Tonehøjde: 0.025" (0.64mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: QFN, Antal positioner: 46, Tonehøjde: 0.016" (0.40mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: FPC Connector, Antal positioner: 20, Tonehøjde: 0.031" (0.80mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: DFN, Antal positioner: 8, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: DFN, Antal positioner: 16, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: DFN, Antal positioner: 6, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: HSOP, Antal positioner: 44, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: QFN, Antal positioner: 44, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: MLP, MLF, Antal positioner: 8, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: MicroSMD, BGA, Antal positioner: 4, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: DFN, Antal positioner: 18, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: QFN, Antal positioner: 28, Tonehøjde: 0.031" (0.80mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,