Proto Board Type: SMD to DIP, Pakke accepteret: TSSOP, Antal positioner: 20, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SOIC, Antal positioner: 14, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SOIC, Antal positioner: 24, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: TSSOP, Antal positioner: 8, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: TSSOP, Antal positioner: 14, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SOT-23, SC-59, Antal positioner: 6, Tonehøjde: 0.037" (0.95mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SOT-23, Antal positioner: 6, Tonehøjde: 0.037" (0.95mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: FPC Connector, Antal positioner: 10, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SOIC, Antal positioner: 8, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: MSOP, uMAX, uSOP, Antal positioner: 8, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: TSSOP, Antal positioner: 16, Tonehøjde: 0.026" (0.65mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: VSSOP, Antal positioner: 8, Tonehøjde: 0.020" (0.50mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
Proto Board Type: SMD to DIP, Pakke accepteret: SOIC, Antal positioner: 16, Tonehøjde: 0.050" (1.27mm), Board tykkelse: 0.062" (1.57mm) 1/16", Materiale: FR4 Epoxy Glass,
