Stik til IC'er, transistorer

220-2600-00-0602

Dele Stock.: 1928

Type: SIP, ZIF (ZIP), Antal positioner eller pins (gitter): 20 (1 x 20), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontaktmateriale - Parring: Beryllium Copper,

228-7396-55-1902

Dele Stock.: 1954

Type: SOIC, Antal positioner eller pins (gitter): 28 (2 x 14), Kontakt Finish - Parring: Gold, Kontaktmateriale - Parring: Beryllium Copper,

255-7322-02-0602

Dele Stock.: 132

255-7322-01-0602

Dele Stock.: 73

255-7322-52-0602

Dele Stock.: 109

203-2737-55-1102

Dele Stock.: 2093

Type: Transistor, TO-3 and TO-66, Antal positioner eller pins (gitter): 3 (Rectangular), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,

255-7322-51-0602

Dele Stock.: 117

256-1292-00-0602J

Dele Stock.: 2155

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Antal positioner eller pins (gitter): 56 (2 x 28), Pitch - Parring: 0.070" (1.78mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,

232-1270-51-0602

Dele Stock.: 2165

232-1270-02-0602

Dele Stock.: 2092

Type: PGA, ZIF (ZIP), Antal positioner eller pins (gitter): 32 (2 x 16), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,

232-1270-01-0602

Dele Stock.: 2100

Type: PGA, ZIF (ZIP), Antal positioner eller pins (gitter): 32 (2 x 16), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,

242-1289-00-0602J

Dele Stock.: 2162

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Antal positioner eller pins (gitter): 42 (2 x 21), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,

240-1288-00-0602J

Dele Stock.: 2125

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Antal positioner eller pins (gitter): 40 (2 x 20), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,

210-2599-00-0602

Dele Stock.: 2176

Type: SIP, ZIF (ZIP), Antal positioner eller pins (gitter): 10 (1 x 10), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,

220-2600-50-0602

Dele Stock.: 53

239-5605-52-0602

Dele Stock.: 2106

264-1300-00-0602J

Dele Stock.: 2266

Type: DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing, Antal positioner eller pins (gitter): 64 (2 x 32), Pitch - Parring: 0.070" (1.78mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,

232-1270-52-0602

Dele Stock.: 2083

239-5605-51-0602

Dele Stock.: 2170

220-7201-55-1902

Dele Stock.: 2316

Type: SOIC, Antal positioner eller pins (gitter): 20 (2 x 10), Kontakt Finish - Parring: Gold, Kontaktmateriale - Parring: Beryllium Copper,

240-3639-00-0602J

Dele Stock.: 2318

Type: DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing, Antal positioner eller pins (gitter): 40 (2 x 20), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,

224-7397-55-1902

Dele Stock.: 2189

Type: SOIC, Antal positioner eller pins (gitter): 24 (2 x 12), Kontakt Finish - Parring: Gold, Kontaktmateriale - Parring: Beryllium Copper,

210-2599-50-0602

Dele Stock.: 146

232-1287-00-0602J

Dele Stock.: 2553

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Antal positioner eller pins (gitter): 32 (2 x 16), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,

216-7383-55-1902

Dele Stock.: 2673

Type: SOIC, Antal positioner eller pins (gitter): 16 (2 x 8), Kontakt Finish - Parring: Gold, Kontaktmateriale - Parring: Beryllium Copper,

216-7224-55-1902

Dele Stock.: 2645

Type: SOIC, Antal positioner eller pins (gitter): 16 (2 x 8), Kontakt Finish - Parring: Gold, Kontaktmateriale - Parring: Beryllium Copper,

228-1371-00-0602J

Dele Stock.: 2767

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Antal positioner eller pins (gitter): 28 (2 x 14), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,

248-1282-00-0602J

Dele Stock.: 2700

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Antal positioner eller pins (gitter): 48 (2 x 24), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,

242-1293-00-0602J

Dele Stock.: 2865

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Antal positioner eller pins (gitter): 42 (2 x 21), Pitch - Parring: 0.070" (1.78mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,

232-1291-00-0602J

Dele Stock.: 2903

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Antal positioner eller pins (gitter): 32 (2 x 16), Pitch - Parring: 0.070" (1.78mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,

218-7223-55-1902

Dele Stock.: 2595

Type: SOIC, Antal positioner eller pins (gitter): 18 (2 x 9), Kontakt Finish - Parring: Gold, Kontaktmateriale - Parring: Beryllium Copper,

214-7390-55-1902

Dele Stock.: 2872

Type: SOIC, Antal positioner eller pins (gitter): 14 (2 x 7), Kontakt Finish - Parring: Gold, Kontaktmateriale - Parring: Beryllium Copper,

208-7391-55-1902

Dele Stock.: 2959

Type: SOIC, Antal positioner eller pins (gitter): 8 (2 x 4), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,

224-5248-00-0602J

Dele Stock.: 3223

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing, Antal positioner eller pins (gitter): 24 (2 x 12), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,

224-1286-00-0602J

Dele Stock.: 3366

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing, Antal positioner eller pins (gitter): 24 (2 x 12), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,

228-4817-00-0602J

Dele Stock.: 3381

Type: DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing, Antal positioner eller pins (gitter): 28 (2 x 14), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,