Type: DIP, 0.6" (15.24mm) Row Spacing, Antal positioner eller pins (gitter): 48 (2 x 24), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,
Type: DIP, 0.9" (22.86mm) Row Spacing, Antal positioner eller pins (gitter): 52 (2 x 26), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,
Type: DIP, 0.6" (15.24mm) Row Spacing, Antal positioner eller pins (gitter): 52 (2 x 26), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,
Type: DIP, 0.9" (22.86mm) Row Spacing, Antal positioner eller pins (gitter): 64 (2 x 32), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,
Type: DIP, 0.6" (15.24mm) Row Spacing, Antal positioner eller pins (gitter): 40 (2 x 20), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 30.0µin (0.76µm), Kontaktmateriale - Parring: Beryllium Copper,
Type: PGA, Antal positioner eller pins (gitter): 576 (24 x 24), Pitch - Parring: 0.039" (1.00mm), Kontakt Finish - Parring: Gold,
Type: SIP, Antal positioner eller pins (gitter): 10 (1 x 10), Pitch - Parring: 0.100" (2.54mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: Flash, Kontaktmateriale - Parring: Beryllium Copper,
Type: Camera Socket, Antal positioner eller pins (gitter): 32 (4 x 8), Pitch - Parring: 0.035" (0.90mm), Kontakt Finish - Parring: Gold, Kontakt Finish Tykkelse - Parring: 12.0µin (0.30µm), Kontaktmateriale - Parring: Copper Alloy,